Dear Hiring Manager,

I am writing to express my interest in the IC Packaging Engineer position at your company. With 2 years of post-graduate experience in semiconductor design and manufacturing, I bring a wealth of knowledge and skills to this role.

Currently employed as a Junior IC Packaging Engineer at Halliwell Technologies, I am responsible for producing IC packaging designs from concept to tape out. My duties include defining design flow rules, implementing packaging layouts, optimizing package design for signal/power integrity, and collaborating with the Design team on package model extraction and analysis.

In addition to my practical experience, I hold a Master of Circuit Design and a Bachelor of Software Engineering. I am proficient in Cadence APD, SiP, high-speed IO interfaces (DDR, PCIE, Ethernet), MATLAB, and Python, as per your requirements.

I am passionate about my work and am eager to bring my creativity and drive to a company whose products I deeply admire. I have attached my résumé for your review and consideration.

Thank you for considering my application. I look forward to the opportunity to discuss how my skills and experiences align with the needs of your team.

Sincerely,
Jeffrey Chang